Subcontractor for semiconductor     device assembly.

CIRTEK provides complete turnkey solutions that include services from wafer probe, wafer back grinding, assembly and packaging and final testing of semiconductor devices up to drop shipments to our Customer's end users.
Package offering ranges from simple diodes, transistors, single Integrated Circuit to multiple die assembly and from simple components assembly to complex networks multi-component devices and Multi-Chip Modules(MCM) & Chip on Board (COB). Package outlines are either customer specific and/or compliant to the JEDEC standard.

​Cirtek Electronics is certified to the latest quality system standard (ISO/TS16949, ISO14001, DSCC(DLA), UL and BABT certified manufacturing facility).